PAI resin

PAI resin

Solvent-borne PAI: SI-307/507

Solvent-borne PAI has excellent adhesion, temperature resistance, flexibility and corrosion resistance. At 260℃,it has excellent mechanical performance, excellent dimensional stability and creep resistance, corrosion resistance and radiation resistance.


Product No

NON-Volatile

(%)

Viscosity

(cps)

Remarks

Solvent system

SI-307

30±1

5000-10000

NMP

SI-507

35±1

5000-10000

DMAC